MCF5271CAB100 vs MCF5206CAB25A Comparison

Detailed side-by-side comparison of MCF5271CAB100 by NXP Semiconductors and MCF5206CAB25A by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MCF5271CAB100 MCF5271CAB100 - ColdFire V2 32-bit MPU 100MHz 160-QFP | NXP

MCF5271CAB100 - ColdFire V2 32-bit MPU 100MHz 160-QFP | NXP

MCF5271CAB100 ⚠ Last Time Buy
NXP Semiconductors
MCF5206CAB25A MCF5206CAB25A - ColdFire V2 MPU, 25MHz, 160-PQFP | NXP

MCF5206CAB25A - ColdFire V2 MPU, 25MHz, 160-PQFP | NXP

MCF5206CAB25A ⚠ Last Time Buy

Specification Comparison

Parameter MCF5271CAB100 MCF5206CAB25A
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Last Time Buy
Core Architecture ColdFire V2 ColdFire V2
Data Bus Width 32-bit 32-bit
Maximum Clock Frequency 100 MHz 25 MHz
On-chip SRAM 64 KB —
On-chip ROM ROMless (0 KB) —
Supply Voltage 3.3 V [DATA_NEEDED: Vcore/Vio range]
Package Type QFP-160 (28x28 mm) —
Mounting Type Surface Mount Surface Mount
Ethernet MAC 10/100 Mbit/s with MII —
CAN Controllers 2x CAN 2.0B —
USB Interface USB 1.1 Device —
UART Count 3 —
I2C Yes —
ADC 10-bit, 8-channel —
External Memory Bus 32-bit SDRAM/SRAM/Flash controller —
Debug Interface JTAG / BDM —
Operating Temperature -40C to +85C [DATA_NEEDED: industrial range]
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Process Node 130 nm —
EMAC Engine Yes (Hardware Multiply-Accumulate) —
Core Count — 1
Program Memory Type — ROMless (external memory required)
Internal SRAM — 512 bytes
Number of I/O Lines — 8
Package / Case — 160-BQFP (160-QFP, 28x28 mm)
Oscillator Type — External
Packaging — Tray
MSL Level — [DATA_NEEDED: MSL rating]

Datasheets & Resources

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