MCF5271CAB100 vs MCF5206CAB25A 对比

详细并排对比 MCF5271CAB100 出自 NXP Semiconductors 和 MCF5206CAB25A 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCF5271CAB100 MCF5271CAB100 - ColdFire V2 32-bit MPU 100MHz 160-QFP | NXP

MCF5271CAB100 - ColdFire V2 32-bit MPU 100MHz 160-QFP | NXP

MCF5271CAB100 ⚠ 最后一次采购
NXP Semiconductors
MCF5206CAB25A MCF5206CAB25A - ColdFire V2 MPU, 25MHz, 160-PQFP | NXP

MCF5206CAB25A - ColdFire V2 MPU, 25MHz, 160-PQFP | NXP

MCF5206CAB25A ⚠ 最后一次采购

规格对比

参数 MCF5271CAB100 MCF5206CAB25A
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 最后采购期
Core Architecture ColdFire V2 ColdFire V2
数据总线宽度 32-bit 32-bit
最大时钟频率 100 MHz 25 MHz
On-chip SRAM 64 KB —
On-chip ROM ROMless (0 KB) —
电源电压 3.3 V [DATA_NEEDED: Vcore/Vio range]
Package Type QFP-160 (28x28 mm) —
安装类型 Surface Mount Surface Mount
Ethernet MAC 10/100 Mbit/s with MII —
CAN Controllers 2x CAN 2.0B —
USB Interface USB 1.1 Device —
UART Count 3 —
I2C Yes —
ADC 10-bit, 8-channel —
External Memory Bus 32-bit SDRAM/SRAM/Flash controller —
Debug Interface JTAG / BDM —
工作温度 -40C to +85C [DATA_NEEDED: industrial range]
RoHS 状态 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Process Node 130 nm —
EMAC Engine Yes (Hardware Multiply-Accumulate) —
Core Count — 1
Program Memory Type — ROMless (external memory required)
Internal SRAM — 512 bytes
Number of I/O Lines — 8
封装 / 外壳 — 160-BQFP (160-QFP, 28x28 mm)
Oscillator Type — External
Packaging — Tray
MSL 等级 — [DATA_NEEDED: MSL rating]

数据手册与资源

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