MCF5271CAB100 vs MCF5206CAB25A 对比
详细并排对比 MCF5271CAB100 出自 NXP Semiconductors 和 MCF5206CAB25A 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。
NXP Semiconductors
MCF5271CAB100 - ColdFire V2 32-bit MPU 100MHz 160-QFP | NXP
MCF5271CAB100 ⚠ 最后一次采购规格对比
| 参数 | MCF5271CAB100 | MCF5206CAB25A |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 最后采购期 |
| Core Architecture | ColdFire V2 | ColdFire V2 |
| 数据总线宽度 | 32-bit | 32-bit |
| 最大时钟频率 | 100 MHz | 25 MHz |
| On-chip SRAM | 64 KB | — |
| On-chip ROM | ROMless (0 KB) | — |
| 电源电压 | 3.3 V | [DATA_NEEDED: Vcore/Vio range] |
| Package Type | QFP-160 (28x28 mm) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Ethernet MAC | 10/100 Mbit/s with MII | — |
| CAN Controllers | 2x CAN 2.0B | — |
| USB Interface | USB 1.1 Device | — |
| UART Count | 3 | — |
| I2C | Yes | — |
| ADC | 10-bit, 8-channel | — |
| External Memory Bus | 32-bit SDRAM/SRAM/Flash controller | — |
| Debug Interface | JTAG / BDM | — |
| 工作温度 | -40C to +85C | [DATA_NEEDED: industrial range] |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance] |
| Process Node | 130 nm | — |
| EMAC Engine | Yes (Hardware Multiply-Accumulate) | — |
| Core Count | — | 1 |
| Program Memory Type | — | ROMless (external memory required) |
| Internal SRAM | — | 512 bytes |
| Number of I/O Lines | — | 8 |
| 封装 / 外壳 | — | 160-BQFP (160-QFP, 28x28 mm) |
| Oscillator Type | — | External |
| Packaging | — | Tray |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |