MCF5372LCVM240J vs SCF5250VM120 Comparison
Detailed side-by-side comparison of MCF5372LCVM240J by NXP Semiconductors and SCF5250VM120 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MCF5372LCVM240J - ColdFire V3 240MHz 32-Bit MPU | NXP | 196-LBGA
MCF5372LCVM240J NrndSpecification Comparison
| Parameter | MCF5372LCVM240J | SCF5250VM120 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Unknown |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $25.10 | $0.00 |
| Core | ColdFire V3 (MCF537x) | — |
| Data Bus Width | 32-bit | — |
| Maximum Clock Frequency | 240 MHz | — |
| Architecture | Variable-length RISC (ColdFire) | RISC 32-bit |
| Program Memory Type | ROMless (external boot memory required) | — |
| Package / Case | 196-LBGA (MAP-BGA, 15x15 mm) | — |
| Mounting Type | Surface Mount (BGA) | — |
| Operating Temperature | [DATA_NEEDED: industrial temperature grade confirmed by 'J' suffix; full range not in provided web data] | [DATA_NEEDED: operating temperature range] |
| Number of I/O | [DATA_NEEDED: number of GPIO pins not in provided web data] | — |
| Supply Voltage | [DATA_NEEDED: core and I/O voltage not in provided web data] | 3.3 V |
| Peripherals | Ethernet MAC, USB, UART, timers (per MCF5372 family) | — |
| External Memory Interface | External SDRAM/NOR Flash bus | — |
| RoHS Status | [DATA_NEEDED: explicit RoHS statement not in provided web data] | [DATA_NEEDED: RoHS compliance] |
| MSL Level | [DATA_NEEDED: MSL rating not in provided web data] | — |
| Lifecycle Status | NRND (Not Recommended for New Designs) | — |
| Product Type | — | 32-bit ROMless microcontroller |
| Processor Core | — | ColdFire V2 MCF52xx |
| Maximum Processor Frequency | — | 120 MHz |
| RAM Size | — | 128 kB |
| Program Memory | — | ROMless |
| Number of I/O Pins | — | 57 |
| Process Technology | — | 0.13 um |
| Package | — | 196-LBGA (15 x 15 mm) |
| Package Type | — | MAP-BGA-196 |
| Tray Packaging | — | Tray |
| Manufacturer | — | NXP Semiconductors |
| Datasheet File Size | — | 1 MB |
| Datasheet Page Count | — | 56 pages |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |