MCF5372LCVM240J vs SCF5250VM120 Comparación
Comparación detallada lado a lado de MCF5372LCVM240J por NXP Semiconductors y SCF5250VM120 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MCF5372LCVM240J - ColdFire V3 240MHz 32-Bit MPU | NXP | 196-LBGA
MCF5372LCVM240J NrndComparación de especificaciones
| Parámetro | MCF5372LCVM240J | SCF5250VM120 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Unknown |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,10 | $0,00 |
| Core | ColdFire V3 (MCF537x) | — |
| Ancho del bus de datos | 32-bit | — |
| Frecuencia de reloj máxima | 240 MHz | — |
| Architecture | Variable-length RISC (ColdFire) | RISC 32-bit |
| Program Memory Type | ROMless (external boot memory required) | — |
| Encapsulado / Carcasa | 196-LBGA (MAP-BGA, 15x15 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: industrial temperature grade confirmed by 'J' suffix; full range not in provided web data] | [DATA_NEEDED: operating temperature range] |
| Number of I/O | [DATA_NEEDED: number of GPIO pins not in provided web data] | — |
| Tensión de alimentación | [DATA_NEEDED: core and I/O voltage not in provided web data] | 3.3 V |
| Peripherals | Ethernet MAC, USB, UART, timers (per MCF5372 family) | — |
| External Memory Interface | External SDRAM/NOR Flash bus | — |
| Estado RoHS | [DATA_NEEDED: explicit RoHS statement not in provided web data] | [DATA_NEEDED: RoHS compliance] |
| Nivel MSL | [DATA_NEEDED: MSL rating not in provided web data] | — |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) | — |
| Product Type | — | 32-bit ROMless microcontroller |
| Processor Core | — | ColdFire V2 MCF52xx |
| Maximum Processor Frequency | — | 120 MHz |
| RAM Size | — | 128 kB |
| Program Memory | — | ROMless |
| Number of I/O Pins | — | 57 |
| Process Technology | — | 0.13 um |
| Encapsulado | — | 196-LBGA (15 x 15 mm) |
| Package Type | — | MAP-BGA-196 |
| Tray Packaging | — | Tray |
| Manufacturer | — | NXP Semiconductors |
| Datasheet File Size | — | 1 MB |
| Datasheet Page Count | — | 56 pages |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |