MCF5372LCVM240J vs SCF5250VM120 Сравнение
Подробное сравнение бок о бок MCF5372LCVM240J от NXP Semiconductors и SCF5250VM120 от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MCF5372LCVM240J - ColdFire V3 240MHz 32-Bit MPU | NXP | 196-LBGA
MCF5372LCVM240J NrndСравнение характеристик
| Параметр | MCF5372LCVM240J | SCF5250VM120 |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | NRND | Unknown |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $25,10 | $0,00 |
| Core | ColdFire V3 (MCF537x) | — |
| Разрядность шины данных | 32-bit | — |
| Максимальная тактовая частота | 240 MHz | — |
| Architecture | Variable-length RISC (ColdFire) | RISC 32-bit |
| Program Memory Type | ROMless (external boot memory required) | — |
| Корпус / Типоразмер | 196-LBGA (MAP-BGA, 15x15 mm) | — |
| Тип монтажа | Surface Mount (BGA) | — |
| Рабочая температура | [DATA_NEEDED: industrial temperature grade confirmed by 'J' suffix; full range not in provided web data] | [DATA_NEEDED: operating temperature range] |
| Number of I/O | [DATA_NEEDED: number of GPIO pins not in provided web data] | — |
| Напряжение питания | [DATA_NEEDED: core and I/O voltage not in provided web data] | 3.3 V |
| Peripherals | Ethernet MAC, USB, UART, timers (per MCF5372 family) | — |
| External Memory Interface | External SDRAM/NOR Flash bus | — |
| Статус RoHS | [DATA_NEEDED: explicit RoHS statement not in provided web data] | [DATA_NEEDED: RoHS compliance] |
| Уровень MSL | [DATA_NEEDED: MSL rating not in provided web data] | — |
| Статус жизненного цикла | NRND (Not Recommended for New Designs) | — |
| Product Type | — | 32-bit ROMless microcontroller |
| Processor Core | — | ColdFire V2 MCF52xx |
| Maximum Processor Frequency | — | 120 MHz |
| RAM Size | — | 128 kB |
| Program Memory | — | ROMless |
| Number of I/O Pins | — | 57 |
| Process Technology | — | 0.13 um |
| Корпус | — | 196-LBGA (15 x 15 mm) |
| Package Type | — | MAP-BGA-196 |
| Tray Packaging | — | Tray |
| Manufacturer | — | NXP Semiconductors |
| Datasheet File Size | — | 1 MB |
| Datasheet Page Count | — | 56 pages |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |