MPC755BPX350LE vs MPC745BPX350LE Comparison

Detailed side-by-side comparison of MPC755BPX350LE by NXP Semiconductors and MPC745BPX350LE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC755BPX350LE MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE - PowerPC 350MHz MPU, 360-FCPBGA | NXP

MPC755BPX350LE Nrnd
NXP Semiconductors
MPC745BPX350LE MPC745BPX350LE - PowerPC 32-bit MPU 350MHz BGA-255 | NXP

MPC745BPX350LE - PowerPC 32-bit MPU 350MHz BGA-255 | NXP

MPC745BPX350LE Obsolete

Specification Comparison

Parameter MPC755BPX350LE MPC745BPX350LE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $49.90 $64.80
Product Type Microprocessor (MPU) —
Architecture RISC, PowerPC MPC7xx —
Core Count 1 —
Data Bus Width 64-Bit 64-bit
Clock Speed (Core) 350 MHz —
Supply Voltage (Core) 2 V 2 V
I/O Supply Voltage 3.3 V —
Package 360-FCPBGA (25x25 mm, 1.27 mm pitch) —
Terminal Form Ball —
Number of Terminals 360 —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
Process Technology 0.22 micrometer CMOS —
Moisture Sensitivity Level (MSL) 3 —
Package Type FCBGA-360, Plastic, 25x25 mm, 2.77 mm height FCBGA-255 (Plastic BGA, 21 x 21 mm)
RoHS Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS compliance]
Manufacturer — NXP Semiconductors (formerly Motorola/Freescale)
Product Series — MPC7xx (MPC745)
Core Architecture — PowerPC RISC
Maximum Clock Frequency — 350 MHz
Number of Cores — 1
Pin Count — 255
Ball Pitch — 1.27 mm
Package Height — 2.80 mm
Mounting Type — Surface Mount (BGA)
Boundary Scan — Yes (JTAG/IEEE 1149.1)
Operating Temperature — [DATA_NEEDED: operating temperature range]
Lead-Free — [DATA_NEEDED: lead-free status]

Datasheets & Resources

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