MPC755BPX350LE vs MPC745BPX350LE Vergleich
Detaillierter Direktvergleich von MPC755BPX350LE von NXP Semiconductors und MPC745BPX350LE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC755BPX350LE | MPC745BPX350LE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $49,90 | $64,80 |
| Product Type | Microprocessor (MPU) | — |
| Architecture | RISC, PowerPC MPC7xx | — |
| Core Count | 1 | — |
| Datenbusbreite | 64-Bit | 64-bit |
| Clock Speed (Core) | 350 MHz | — |
| Supply Voltage (Core) | 2 V | 2 V |
| I/O Supply Voltage | 3.3 V | — |
| Gehäuse | 360-FCPBGA (25x25 mm, 1.27 mm pitch) | — |
| Terminal Form | Ball | — |
| Number of Terminals | 360 | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Process Technology | 0.22 micrometer CMOS | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 | — |
| Package Type | FCBGA-360, Plastic, 25x25 mm, 2.77 mm height | FCBGA-255 (Plastic BGA, 21 x 21 mm) |
| RoHS-Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance] |
| Manufacturer | — | NXP Semiconductors (formerly Motorola/Freescale) |
| Product Series | — | MPC7xx (MPC745) |
| Core Architecture | — | PowerPC RISC |
| Maximale Taktfrequenz | — | 350 MHz |
| Number of Cores | — | 1 |
| Pin-Anzahl | — | 255 |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 2.80 mm |
| Montageart | — | Surface Mount (BGA) |
| Boundary Scan | — | Yes (JTAG/IEEE 1149.1) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |