MPC755BVT300LE vs MPC603RVG300LC Comparison
Detailed side-by-side comparison of MPC755BVT300LE by NXP Semiconductors and MPC603RVG300LC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC755BVT300LE - PowerPC MPU 300MHz 360-FCBGA | NXP Semiconductors
MPC755BVT300LE Nrnd
Specification Comparison
| Parameter | MPC755BVT300LE | MPC603RVG300LC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Product Family | MPC7xx (PowerPC) | — |
| Architecture | RISC, PowerPC | — |
| Core Count | 1 | 1 |
| Data Bus Width | 64-bit | — |
| Instruction Width | 32-bit | — |
| Maximum Clock Frequency | 300 MHz | — |
| Supply Voltage | 2 V / 2.5 V / 3.3 V | — |
| Package Type | FCBGA (Flip-Chip BGA) | — |
| Pin/Ball Count | 360 | — |
| Package Dimensions | 25 x 25 mm | — |
| Ball Pitch | 1.27 mm | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0C to +105C | — |
| Lead-Free / RoHS | Lead-free, RoHS compliant | — |
| L1 Cache | Integrated (instruction + data) | — |
| MMU | Yes (demand-paged virtual memory) | — |
| Power Modes | Nap, Doze, Sleep | — |
| Tray Packaging | Yes (per Arrow listing) | — |
| Processor Type | — | MPC603e PowerPC |
| Core Architecture | — | PowerPC RISC, 32-bit (64-bit data bus) |
| Operating Frequency | — | 300 MHz |
| Core Voltage | — | 2.5 V |
| I/O Voltage | — | 3.3 V |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| External Data Bus | — | 64-bit |
| Process Technology | — | 0.29 um CMOS |
| Package | — | 255-FCCBGA (21x21 mm) with exposed pad |
| Packaging Media | — | Tray |
| Lead Free Status | — | Lead Free |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |