MPC755BVT300LE vs MPC603RVG300LC Vergleich
Detaillierter Direktvergleich von MPC755BVT300LE von NXP Semiconductors und MPC603RVG300LC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC755BVT300LE - PowerPC MPU 300MHz 360-FCBGA | NXP Semiconductors
MPC755BVT300LE Nrnd
Spezifikationsvergleich
| Parameter | MPC755BVT300LE | MPC603RVG300LC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Product Family | MPC7xx (PowerPC) | — |
| Architecture | RISC, PowerPC | — |
| Core Count | 1 | 1 |
| Datenbusbreite | 64-bit | — |
| Instruction Width | 32-bit | — |
| Maximale Taktfrequenz | 300 MHz | — |
| Versorgungsspannung | 2 V / 2.5 V / 3.3 V | — |
| Package Type | FCBGA (Flip-Chip BGA) | — |
| Pin/Ball Count | 360 | — |
| Package Dimensions | 25 x 25 mm | — |
| Ball Pitch | 1.27 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +105C | — |
| Lead-Free / RoHS | Lead-free, RoHS compliant | — |
| L1 Cache | Integrated (instruction + data) | — |
| MMU | Yes (demand-paged virtual memory) | — |
| Power Modes | Nap, Doze, Sleep | — |
| Tray Packaging | Yes (per Arrow listing) | — |
| Processor Type | — | MPC603e PowerPC |
| Core Architecture | — | PowerPC RISC, 32-bit (64-bit data bus) |
| Operating Frequency | — | 300 MHz |
| Core Voltage | — | 2.5 V |
| I/O Voltage | — | 3.3 V |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| External Data Bus | — | 64-bit |
| Process Technology | — | 0.29 um CMOS |
| Gehäuse | — | 255-FCCBGA (21x21 mm) with exposed pad |
| Packaging Media | — | Tray |
| Lead Free Status | — | Lead Free |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |