MPC755BVT300LE vs MPC603RVG300LC 对比

详细并排对比 MPC755BVT300LE 出自 NXP Semiconductors 和 MPC603RVG300LC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC603RVG300LC MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP

MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP

MPC603RVG300LC Nrnd

规格对比

参数 MPC755BVT300LE MPC603RVG300LC
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
Manufacturer NXP Semiconductors (formerly Freescale) —
Product Family MPC7xx (PowerPC) —
Architecture RISC, PowerPC —
Core Count 1 1
数据总线宽度 64-bit —
Instruction Width 32-bit —
最大时钟频率 300 MHz —
电源电压 2 V / 2.5 V / 3.3 V —
Package Type FCBGA (Flip-Chip BGA) —
Pin/Ball Count 360 —
Package Dimensions 25 x 25 mm —
Ball Pitch 1.27 mm —
安装类型 Surface Mount Surface Mount (BGA)
工作温度 0C to +105C —
Lead-Free / RoHS Lead-free, RoHS compliant —
L1 Cache Integrated (instruction + data) —
MMU Yes (demand-paged virtual memory) —
Power Modes Nap, Doze, Sleep —
Tray Packaging Yes (per Arrow listing) —
Processor Type — MPC603e PowerPC
Core Architecture — PowerPC RISC, 32-bit (64-bit data bus)
Operating Frequency — 300 MHz
Core Voltage — 2.5 V
I/O Voltage — 3.3 V
L1 Instruction Cache — 16 KB
L1 Data Cache — 16 KB
External Data Bus — 64-bit
Process Technology — 0.29 um CMOS
封装 — 255-FCCBGA (21x21 mm) with exposed pad
Packaging Media — Tray
Lead Free Status — Lead Free
工作温度范围 — [DATA_NEEDED: operating temperature range]

数据手册与资源

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