MPC8245LVV333D vs MPC8245LVV266D Comparison

Detailed side-by-side comparison of MPC8245LVV333D by NXP Semiconductors and MPC8245LVV266D by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete
NXP Semiconductors
MPC8245LVV266D MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D ✗ End of Life

Specification Comparison

Parameter MPC8245LVV333D MPC8245LVV266D
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Obsolete End of Life
Stock Status In Stock In Stock
Unit Price (USD) $52.75 $48.90
Manufacturer NXP USA Inc. (formerly Freescale / Motorola) NXP USA Inc.
Product Category Microprocessors (MPU) —
Core Architecture PowerPC 603e (Power Architecture technology) —
Core Count 1 —
Data Bus Width 32-bit —
Core Frequency 333 MHz —
Integrated Bridge PCI bridge + memory controller —
PCI Interface PCI 2.2 compliant, 32-bit, up to 66 MHz —
Memory Controller 64-bit SDRAM (PC133), ROM/Flash interface DDR SDRAM
Supply Voltage - Core 2.0 V (L suffix, low-voltage core) —
Supply Voltage - I/O 3.3 V —
Operating Temperature 0 C to +105 C (junction) 0C to +105C (industrial, 'D' suffix)
Package / Case 352-TBGA (35x35 mm) —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status [DATA_NEEDED: rohs status not confirmed in verified web data] RoHS compliant (lead-free)
Lead-Free / BGA Solder [DATA_NEEDED: lead-free status not confirmed] —
Part Family — PowerQUICC II (MPC82xx)
Processor Core — PowerPC MPC603e (32-bit Power Architecture)
Core Clock Speed — 266 MHz
Performance — 505.4 MIPS
Number of Cores — 1
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Core Voltage (Vcc) — 1.8 V
I/O Voltage — 3.3 V
Package — 352-TBGA (35x35 mm)
Packaging — Tray
Integrated PCI Bridge — Yes, 32-bit / 66 MHz PCI
Lifecycle Status — End of Life (per NXP product page)

Datasheets & Resources

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