MPC8245LVV333D vs MPC8245LVV266D Vergleich
Detaillierter Direktvergleich von MPC8245LVV333D von NXP Semiconductors und MPC8245LVV266D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D ObsoleteNXP Semiconductors
MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking
MPC8245LVV266D ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC8245LVV333D | MPC8245LVV266D |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,75 | $48,90 |
| Manufacturer | NXP USA Inc. (formerly Freescale / Motorola) | NXP USA Inc. |
| Product Category | Microprocessors (MPU) | — |
| Core Architecture | PowerPC 603e (Power Architecture technology) | — |
| Core Count | 1 | — |
| Datenbusbreite | 32-bit | — |
| Core Frequency | 333 MHz | — |
| Integrated Bridge | PCI bridge + memory controller | — |
| PCI Interface | PCI 2.2 compliant, 32-bit, up to 66 MHz | — |
| Memory Controller | 64-bit SDRAM (PC133), ROM/Flash interface | DDR SDRAM |
| Supply Voltage - Core | 2.0 V (L suffix, low-voltage core) | — |
| Supply Voltage - I/O | 3.3 V | — |
| Betriebstemperatur | 0 C to +105 C (junction) | 0C to +105C (industrial, 'D' suffix) |
| Gehäuse / Bauform | 352-TBGA (35x35 mm) | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | [DATA_NEEDED: rohs status not confirmed in verified web data] | RoHS compliant (lead-free) |
| Lead-Free / BGA Solder | [DATA_NEEDED: lead-free status not confirmed] | — |
| Part Family | — | PowerQUICC II (MPC82xx) |
| Processor Core | — | PowerPC MPC603e (32-bit Power Architecture) |
| Core Clock Speed | — | 266 MHz |
| Performance | — | 505.4 MIPS |
| Number of Cores | — | 1 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Core Voltage (Vcc) | — | 1.8 V |
| I/O Voltage | — | 3.3 V |
| Gehäuse | — | 352-TBGA (35x35 mm) |
| Packaging | — | Tray |
| Integrated PCI Bridge | — | Yes, 32-bit / 66 MHz PCI |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |