MPC8245LVV333D vs MPC8245LVV266D Comparação

Comparação detalhada lado a lado de MPC8245LVV333D por NXP Semiconductors e MPC8245LVV266D por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete
NXP Semiconductors
MPC8245LVV266D MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D - 266MHz PowerQUICC II MPU | NXP | Networking

MPC8245LVV266D ✗ Fim de vida

Comparação de especificações

Parâmetro MPC8245LVV333D MPC8245LVV266D
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Obsolete Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $52,75 $48,90
Manufacturer NXP USA Inc. (formerly Freescale / Motorola) NXP USA Inc.
Product Category Microprocessors (MPU) —
Core Architecture PowerPC 603e (Power Architecture technology) —
Core Count 1 —
Largura do barramento de dados 32-bit —
Core Frequency 333 MHz —
Integrated Bridge PCI bridge + memory controller —
PCI Interface PCI 2.2 compliant, 32-bit, up to 66 MHz —
Memory Controller 64-bit SDRAM (PC133), ROM/Flash interface DDR SDRAM
Supply Voltage - Core 2.0 V (L suffix, low-voltage core) —
Supply Voltage - I/O 3.3 V —
Temperatura de operação 0 C to +105 C (junction) 0C to +105C (industrial, 'D' suffix)
Encapsulamento / Caixa 352-TBGA (35x35 mm) —
Tipo de montagem Surface Mount (BGA) Surface Mount (BGA)
Status RoHS [DATA_NEEDED: rohs status not confirmed in verified web data] RoHS compliant (lead-free)
Lead-Free / BGA Solder [DATA_NEEDED: lead-free status not confirmed] —
Part Family — PowerQUICC II (MPC82xx)
Processor Core — PowerPC MPC603e (32-bit Power Architecture)
Core Clock Speed — 266 MHz
Performance — 505.4 MIPS
Number of Cores — 1
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Core Voltage (Vcc) — 1.8 V
I/O Voltage — 3.3 V
Encapsulamento — 352-TBGA (35x35 mm)
Packaging — Tray
Integrated PCI Bridge — Yes, 32-bit / 66 MHz PCI
Status do ciclo de vida — End of Life (per NXP product page)

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