MPC8245LVV333D vs XPC8240LVV200E Comparison
Detailed side-by-side comparison of MPC8245LVV333D by NXP Semiconductors and XPC8240LVV200E by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D ObsoleteSpecification Comparison
| Parameter | MPC8245LVV333D | XPC8240LVV200E |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $52.75 | $29.40 |
| Manufacturer | NXP USA Inc. (formerly Freescale / Motorola) | NXP Semiconductors |
| Product Category | Microprocessors (MPU) | — |
| Core Architecture | PowerPC 603e (Power Architecture technology) | 32-bit RISC PowerPC |
| Core Count | 1 | — |
| Data Bus Width | 32-bit | — |
| Core Frequency | 333 MHz | — |
| Integrated Bridge | PCI bridge + memory controller | PCI bridge (PCI 2.2 compatible) |
| PCI Interface | PCI 2.2 compliant, 32-bit, up to 66 MHz | — |
| Memory Controller | 64-bit SDRAM (PC133), ROM/Flash interface | SDRAM, ROM/Flash, burst SRAM |
| Supply Voltage - Core | 2.0 V (L suffix, low-voltage core) | — |
| Supply Voltage - I/O | 3.3 V | — |
| Operating Temperature | 0 C to +105 C (junction) | Extended (E suffix) |
| Package / Case | 352-TBGA (35x35 mm) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | [DATA_NEEDED: rohs status not confirmed in verified web data] | RoHS Compliant |
| Lead-Free / BGA Solder | [DATA_NEEDED: lead-free status not confirmed] | — |
| Series | — | MPC82xx / PowerQUICC II |
| Core Processor | — | PowerPC 603e |
| Number of Cores | — | 1 |
| Core Clock Speed | — | 200 MHz |
| Core Supply Voltage | — | 2.5 V |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| Local Bus Width | — | 64-bit 60x bus |
| Serial Interfaces | — | 2x UART, I2C |
| Debug Interface | — | JTAG / COP |
| Package | — | 352-TBGA (35 x 35 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |