MPC8245LVV333D vs XPC8240LVV200E Vergleich

Detaillierter Direktvergleich von MPC8245LVV333D von NXP Semiconductors und XPC8240LVV200E von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8245LVV333D MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor

MPC8245LVV333D Obsolete
NXP Semiconductors
XPC8240LVV200E XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E - 200MHz PowerPC 603e MPU 352-TBGA | NXP

XPC8240LVV200E Nrnd

Spezifikationsvergleich

Parameter MPC8245LVV333D XPC8240LVV200E
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $52,75 $29,40
Manufacturer NXP USA Inc. (formerly Freescale / Motorola) NXP Semiconductors
Product Category Microprocessors (MPU) —
Core Architecture PowerPC 603e (Power Architecture technology) 32-bit RISC PowerPC
Core Count 1 —
Datenbusbreite 32-bit —
Core Frequency 333 MHz —
Integrated Bridge PCI bridge + memory controller PCI bridge (PCI 2.2 compatible)
PCI Interface PCI 2.2 compliant, 32-bit, up to 66 MHz —
Memory Controller 64-bit SDRAM (PC133), ROM/Flash interface SDRAM, ROM/Flash, burst SRAM
Supply Voltage - Core 2.0 V (L suffix, low-voltage core) —
Supply Voltage - I/O 3.3 V —
Betriebstemperatur 0 C to +105 C (junction) Extended (E suffix)
Gehäuse / Bauform 352-TBGA (35x35 mm) —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status [DATA_NEEDED: rohs status not confirmed in verified web data] RoHS Compliant
Lead-Free / BGA Solder [DATA_NEEDED: lead-free status not confirmed] —
Series — MPC82xx / PowerQUICC II
Core Processor — PowerPC 603e
Number of Cores — 1
Core Clock Speed — 200 MHz
Core Supply Voltage — 2.5 V
L1 Instruction Cache — 16 KB
L1 Data Cache — 16 KB
Local Bus Width — 64-bit 60x bus
Serial Interfaces — 2x UART, I2C
Debug Interface — JTAG / COP
Gehäuse — 352-TBGA (35 x 35 mm)
Packaging — Tray
Lead Free Status — Lead Free

Datenblätter & Ressourcen

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