MPC8264AZUPJDB vs MPC8260AZUPJDB Comparison
Detailed side-by-side comparison of MPC8264AZUPJDB by NXP Semiconductors and MPC8260AZUPJDB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8264AZUPJDB - PowerQUICC II MPU 300MHz | NXP Semiconductors
MPC8264AZUPJDB ✓ ActiveNXP Semiconductors
MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP
MPC8260AZUPJDB ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8264AZUPJDB | MPC8260AZUPJDB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $58.00 | $165.00 |
| Core Architecture | PowerPC G2 | — |
| Number of Cores | 1 | — |
| Data Bus Width | 32-bit | 32-bit |
| Maximum Clock Frequency | 300 MHz | 300 MHz |
| Package Type | 480-TBGA (37.5 x 37.5 mm) | — |
| Family | PowerQUICC II (MPC82xx) | — |
| Process Technology | 0.25 micron HiP4 CMOS | 0.25 micrometer CMOS (HiP4) |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| Communications Processor Module (CPM) | Integrated | Integrated (FCC, SCC, SMC) |
| Memory Controller | SDRAM / SRAM / Flash support | — |
| PCI Interface | 32-bit PCI | — |
| Ethernet Support | 10/100 Mbps (FCC) | — |
| Serial Communications | SCC, FCC, MCC (multi-channel HDLC) | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Supply Voltage | [DATA_NEEDED: core and I/O voltage] | — |
| Mounting Type | Surface Mount (TBGA) | Surface Mount |
| RoHS Status | Compliant | unknown |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II (MPC8260A HiP4) |
| Core | — | PowerPC G2, single core |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Core Supply Voltage | — | 1.9 V to 2.2 V |
| I/O Supply Voltage | — | 3.3 V |
| Package | — | 480-TBGA (37.5 x 37.5 mm) |
| External Bus | — | 60x bus, 64-bit data |
| Packaging | — | Tray |
| Lifecycle | — | End-of-Life / Last Time Buy (per NXP PCN) |