MPC8264AZUPJDB vs MPC8260AZUPJDB 对比

详细并排对比 MPC8264AZUPJDB 出自 NXP Semiconductors 和 MPC8260AZUPJDB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8264AZUPJDB MPC8264AZUPJDB - PowerQUICC II MPU 300MHz | NXP Semiconductors

MPC8264AZUPJDB - PowerQUICC II MPU 300MHz | NXP Semiconductors

MPC8264AZUPJDB ✓ 量产中
NXP Semiconductors
MPC8260AZUPJDB MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP

MPC8260AZUPJDB - 300MHz PowerQUICC II HiP4 MPU | NXP

MPC8260AZUPJDB ⚠ 最后一次采购

规格对比

参数 MPC8264AZUPJDB MPC8260AZUPJDB
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $58.00 $165.00
Core Architecture PowerPC G2 —
Number of Cores 1 —
数据总线宽度 32-bit 32-bit
最大时钟频率 300 MHz 300 MHz
Package Type 480-TBGA (37.5 x 37.5 mm) —
Family PowerQUICC II (MPC82xx) —
Process Technology 0.25 micron HiP4 CMOS 0.25 micrometer CMOS (HiP4)
Instruction Cache 16 KB —
Data Cache 16 KB —
Communications Processor Module (CPM) Integrated Integrated (FCC, SCC, SMC)
Memory Controller SDRAM / SRAM / Flash support —
PCI Interface 32-bit PCI —
Ethernet Support 10/100 Mbps (FCC) —
Serial Communications SCC, FCC, MCC (multi-channel HDLC) —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
电源电压 [DATA_NEEDED: core and I/O voltage] —
安装类型 Surface Mount (TBGA) Surface Mount
RoHS 状态 Compliant unknown
Manufacturer — NXP Semiconductors
Series — PowerQUICC II (MPC8260A HiP4)
Core — PowerPC G2, single core
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
Core Supply Voltage — 1.9 V to 2.2 V
I/O Supply Voltage — 3.3 V
封装 — 480-TBGA (37.5 x 37.5 mm)
External Bus — 60x bus, 64-bit data
Packaging — Tray
Lifecycle — End-of-Life / Last Time Buy (per NXP PCN)

数据手册与资源

浏览全部产品 创建 BOM 获取报价