MPC8272CVRMIBA vs MPC8321CVRADDC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8272CVRMIBA sa pamamagitan ng NXP Semiconductors at MPC8321CVRADDC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8272CVRMIBA - 266MHz PowerQUICC II MPU | NXP | SoC
MPC8272CVRMIBA ✗ Tapus ng BuhayNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPC8272CVRMIBA | MPC8321CVRADDC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Tapus ng Buhay | Aktibo |
| Architecture | PowerPC G2_LE (32-bit) | — |
| Family | PowerQUICC II (MPC82xx) | — |
| Core Count | 1 | — |
| Core Clock Frequency | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Process Technology | 0.13 um | 90 nm CMOS |
| Volte ng Pagbibigay | 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| Temperature na Operasyon | -40C to +105C | — |
| Packhaging | 516-PBGA (27x27 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI 2.2, USB, UTOPIA, CPM, SEC 2.0, 2x UART, I2C, SPI | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Memory Interface | 32-bit DDR SDRAM with ECC | — |
| Ethernet | 10/100/1000 MAC via CPM | — |
| Security Engine | SEC 2.0 (DES, 3DES, AES, SHA-1, MD-5) | — |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance status] |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core | — | PowerPC e300c2 |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Hanay ng Temperature na Operasyon | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Encryption / SEC Block | — | Not included (non-E variant) |