MPC8272CVRMIBA vs MPC8321CVRADDC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8272CVRMIBA disebabkan oleh NXP Semiconductors dan MPC8321CVRADDC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8272CVRMIBA - 266MHz PowerQUICC II MPU | NXP | SoC
MPC8272CVRMIBA ✗ Akhir HayatNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ AktifPengandingan Spesifikasi
| Parametr | MPC8272CVRMIBA | MPC8321CVRADDC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Aktif |
| Architecture | PowerPC G2_LE (32-bit) | — |
| Family | PowerQUICC II (MPC82xx) | — |
| Core Count | 1 | — |
| Core Clock Frequency | 266 MHz | — |
| Performance | 505.4 MIPS | — |
| Process Technology | 0.13 um | 90 nm CMOS |
| Tegangan Pemberi Arus | 3.3 V | 1.8 V / 2.5 V / 3.3 V |
| Suhu Operasi | -40C to +105C | — |
| Kemasan | 516-PBGA (27x27 mm) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI 2.2, USB, UTOPIA, CPM, SEC 2.0, 2x UART, I2C, SPI | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Memory Interface | 32-bit DDR SDRAM with ECC | — |
| Ethernet | 10/100/1000 MAC via CPM | — |
| Security Engine | SEC 2.0 (DES, 3DES, AES, SHA-1, MD-5) | — |
| Instruction Cache | 16 KB | — |
| Data Cache | 16 KB | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS compliance status] |
| Aras MSL | [DATA_NEEDED: MSL level] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core | — | PowerPC e300c2 |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Package Type | — | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 27 mm x 27 mm |
| Gambaran Suhu Operasi | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Encryption / SEC Block | — | Not included (non-E variant) |