MPC8313CVRADDB vs MPC8313ECVRADDB Comparison
Detailed side-by-side comparison of MPC8313CVRADDB by NXP Semiconductors and MPC8313ECVRADDB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8313CVRADDB - PowerQUICC II Pro 267MHz MPU | NXP 516-BGA
MPC8313CVRADDB ✓ ActiveNXP Semiconductors
MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP
MPC8313ECVRADDB ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8313CVRADDB | MPC8313ECVRADDB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $24.60 | $52.85 |
| Core Architecture | PowerPC e300c3 | 32-bit RISC, single core |
| Number of Cores | 1 | — |
| Data Bus Width | 32-bit | — |
| Maximum Core Frequency | 267 MHz | — |
| Package | 516-TEPBGA (27x27 mm) | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 516 | — |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Memory Controller | DDR1/DDR2 SDRAM | DDR1/DDR2 with ECC |
| Ethernet | Dual 10/100/1000 MAC | — |
| USB | USB 2.0 High-Speed with integrated PHY | USB 2.0 (host/device) |
| PCI Express | 1 x PCIe x1 lane | — |
| Communications Accelerator | QUICC Engine | — |
| Encryption | Without (W/O ENCR) | — |
| Series | MPC83xx | — |
| RoHS Status | Compliant | Compliant (per DigiKey listing) |
| Processor Type | — | PowerPC e300c3, MPC83xx PowerQUICC II Pro |
| Maximum CPU Clock | — | 267 MHz |
| Cache (I-cache / D-cache) | — | 16 KB / 16 KB |
| Security Accelerator | — | SEC 2.x (DES, 3DES, AES, SHA-1, MD5, ARC4) |
| Ethernet MAC | — | 2x 10/100/1000 (TSEC) |
| PCI Express / PCI | — | 1x PCIe + 1x PCI 2.3 |
| I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Core Voltage | — | 0.95 V to 1.05 V |
| Operating Temperature | — | -40C to +105C (industrial) |
| Package / Case | — | 516-TEPBGA, 27x27 mm |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 90 nm CMOS |
| MSL Level | — | 3 |