MPC8313CVRADDB vs MPC8313ECVRADDB Comparación
Comparación detallada lado a lado de MPC8313CVRADDB por NXP Semiconductors y MPC8313ECVRADDB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8313CVRADDB - PowerQUICC II Pro 267MHz MPU | NXP 516-BGA
MPC8313CVRADDB ✓ ActivoNXP Semiconductors
MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP
MPC8313ECVRADDB ⚠ Última compraComparación de especificaciones
| Parámetro | MPC8313CVRADDB | MPC8313ECVRADDB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,60 | $52,85 |
| Core Architecture | PowerPC e300c3 | 32-bit RISC, single core |
| Number of Cores | 1 | — |
| Ancho del bus de datos | 32-bit | — |
| Maximum Core Frequency | 267 MHz | — |
| Encapsulado | 516-TEPBGA (27x27 mm) | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 516 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Memory Controller | DDR1/DDR2 SDRAM | DDR1/DDR2 with ECC |
| Ethernet | Dual 10/100/1000 MAC | — |
| USB | USB 2.0 High-Speed with integrated PHY | USB 2.0 (host/device) |
| PCI Express | 1 x PCIe x1 lane | — |
| Communications Accelerator | QUICC Engine | — |
| Encryption | Without (W/O ENCR) | — |
| Series | MPC83xx | — |
| Estado RoHS | Compliant | Compliant (per DigiKey listing) |
| Processor Type | — | PowerPC e300c3, MPC83xx PowerQUICC II Pro |
| Maximum CPU Clock | — | 267 MHz |
| Cache (I-cache / D-cache) | — | 16 KB / 16 KB |
| Security Accelerator | — | SEC 2.x (DES, 3DES, AES, SHA-1, MD5, ARC4) |
| Ethernet MAC | — | 2x 10/100/1000 (TSEC) |
| PCI Express / PCI | — | 1x PCIe + 1x PCI 2.3 |
| I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Core Voltage | — | 0.95 V to 1.05 V |
| Temperatura de funcionamiento | — | -40C to +105C (industrial) |
| Encapsulado / Carcasa | — | 516-TEPBGA, 27x27 mm |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 90 nm CMOS |
| Nivel MSL | — | 3 |