MPC8313CVRADDB vs MPC8313ECVRADDB Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC8313CVRADDB sa pamamagitan ng NXP Semiconductors at MPC8313ECVRADDB sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC8313CVRADDB MPC8313CVRADDB - PowerQUICC II Pro 267MHz MPU | NXP 516-BGA

MPC8313CVRADDB - PowerQUICC II Pro 267MHz MPU | NXP 516-BGA

MPC8313CVRADDB ✓ Nakahanda
NXP Semiconductors
MPC8313ECVRADDB MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP

MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP

MPC8313ECVRADDB ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro MPC8313CVRADDB MPC8313ECVRADDB
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Huling Pagbili
Core Architecture PowerPC e300c3 32-bit RISC, single core
Number of Cores 1 —
Width ng Data Bus 32-bit —
Maximum Core Frequency 267 MHz —
Packhaging 516-TEPBGA (27x27 mm) —
Package Code BGA —
Terminal Form Ball —
Number of Terminals 516 —
Uri ng Pagpapasok Surface Mount Surface Mount
Operating Temperature Grade Industrial —
Memory Controller DDR1/DDR2 SDRAM DDR1/DDR2 with ECC
Ethernet Dual 10/100/1000 MAC —
USB USB 2.0 High-Speed with integrated PHY USB 2.0 (host/device)
PCI Express 1 x PCIe x1 lane —
Communications Accelerator QUICC Engine —
Encryption Without (W/O ENCR) —
Series MPC83xx —
Tindminan RoHS Compliant Compliant (per DigiKey listing)
Processor Type — PowerPC e300c3, MPC83xx PowerQUICC II Pro
Maximum CPU Clock — 267 MHz
Cache (I-cache / D-cache) — 16 KB / 16 KB
Security Accelerator — SEC 2.x (DES, 3DES, AES, SHA-1, MD5, ARC4)
Ethernet MAC — 2x 10/100/1000 (TSEC)
PCI Express / PCI — 1x PCIe + 1x PCI 2.3
I/O Voltage — 1.8 V / 2.5 V / 3.3 V
Core Voltage — 0.95 V to 1.05 V
Temperature na Operasyon — -40C to +105C (industrial)
Packhaging / Kaso — 516-TEPBGA, 27x27 mm
Lead Free Status — Lead Free
Process Technology — 90 nm CMOS
Level ng MSL — 3

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