MPC8313CVRADDB vs MPC8313ECVRADDB Vergleich
Detaillierter Direktvergleich von MPC8313CVRADDB von NXP Semiconductors und MPC8313ECVRADDB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8313CVRADDB - PowerQUICC II Pro 267MHz MPU | NXP 516-BGA
MPC8313CVRADDB ✓ AktivNXP Semiconductors
MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP
MPC8313ECVRADDB ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8313CVRADDB | MPC8313ECVRADDB |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,60 | $52,85 |
| Core Architecture | PowerPC e300c3 | 32-bit RISC, single core |
| Number of Cores | 1 | — |
| Datenbusbreite | 32-bit | — |
| Maximum Core Frequency | 267 MHz | — |
| Gehäuse | 516-TEPBGA (27x27 mm) | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 516 | — |
| Montageart | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Memory Controller | DDR1/DDR2 SDRAM | DDR1/DDR2 with ECC |
| Ethernet | Dual 10/100/1000 MAC | — |
| USB | USB 2.0 High-Speed with integrated PHY | USB 2.0 (host/device) |
| PCI Express | 1 x PCIe x1 lane | — |
| Communications Accelerator | QUICC Engine | — |
| Encryption | Without (W/O ENCR) | — |
| Series | MPC83xx | — |
| RoHS-Status | Compliant | Compliant (per DigiKey listing) |
| Processor Type | — | PowerPC e300c3, MPC83xx PowerQUICC II Pro |
| Maximum CPU Clock | — | 267 MHz |
| Cache (I-cache / D-cache) | — | 16 KB / 16 KB |
| Security Accelerator | — | SEC 2.x (DES, 3DES, AES, SHA-1, MD5, ARC4) |
| Ethernet MAC | — | 2x 10/100/1000 (TSEC) |
| PCI Express / PCI | — | 1x PCIe + 1x PCI 2.3 |
| I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Core Voltage | — | 0.95 V to 1.05 V |
| Betriebstemperatur | — | -40C to +105C (industrial) |
| Gehäuse / Bauform | — | 516-TEPBGA, 27x27 mm |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 90 nm CMOS |
| MSL-Level | — | 3 |