MPC8313CVRADDB vs MPC8313ECVRADDB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC8313CVRADDB disebabkan oleh NXP Semiconductors dan MPC8313ECVRADDB disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
NXP Semiconductors
MPC8313CVRADDB - PowerQUICC II Pro 267MHz MPU | NXP 516-BGA
MPC8313CVRADDB ✓ AktifNXP Semiconductors
MPC8313ECVRADDB - PowerQUICC II Pro MPU, 267MHz, 516-TEPBGA | NXP
MPC8313ECVRADDB ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | MPC8313CVRADDB | MPC8313ECVRADDB |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | Masa Terakhir Dibeli |
| Core Architecture | PowerPC e300c3 | 32-bit RISC, single core |
| Number of Cores | 1 | — |
| Lebar Bus Data | 32-bit | — |
| Maximum Core Frequency | 267 MHz | — |
| Kemasan | 516-TEPBGA (27x27 mm) | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Number of Terminals | 516 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Memory Controller | DDR1/DDR2 SDRAM | DDR1/DDR2 with ECC |
| Ethernet | Dual 10/100/1000 MAC | — |
| USB | USB 2.0 High-Speed with integrated PHY | USB 2.0 (host/device) |
| PCI Express | 1 x PCIe x1 lane | — |
| Communications Accelerator | QUICC Engine | — |
| Encryption | Without (W/O ENCR) | — |
| Series | MPC83xx | — |
| Status RoHS | Compliant | Compliant (per DigiKey listing) |
| Processor Type | — | PowerPC e300c3, MPC83xx PowerQUICC II Pro |
| Maximum CPU Clock | — | 267 MHz |
| Cache (I-cache / D-cache) | — | 16 KB / 16 KB |
| Security Accelerator | — | SEC 2.x (DES, 3DES, AES, SHA-1, MD5, ARC4) |
| Ethernet MAC | — | 2x 10/100/1000 (TSEC) |
| PCI Express / PCI | — | 1x PCIe + 1x PCI 2.3 |
| I/O Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Core Voltage | — | 0.95 V to 1.05 V |
| Suhu Operasi | — | -40C to +105C (industrial) |
| Kemasan / Case | — | 516-TEPBGA, 27x27 mm |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 90 nm CMOS |
| Aras MSL | — | 3 |