MPC8358EVVAGDGA vs MPC8360EVVAGDGA Comparison
Detailed side-by-side comparison of MPC8358EVVAGDGA by NXP Semiconductors and MPC8360EVVAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ End of LifeNXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Last Time BuySpecification Comparison
| Parameter | MPC8358EVVAGDGA | MPC8360EVVAGDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | Last Time Buy |
| Architecture | RISC (PowerPC e300) | — |
| Data Bus Width | 32-Bit | 32-bit |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | 1 |
| Core Process Technology | 0.13 µm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Package Type | TBGA-740 | — |
| Package Dimensions | 37.5 x 37.5 mm, 1.46 mm height | — |
| Ball Pitch | 1.0 mm | — |
| Pin Count | 740 | — |
| Operating Temperature | 0 °C to +105 °C | — |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM with ECC | — |
| Ethernet Interfaces | Gigabit (10/100/1000 Mbps) | — |
| USB | USB 2.0 FS device/host | USB 2.0 |
| PCI | PCI 2.2 | — |
| Security Engine | SEC (DES/3DES/AES/SHA) | SEC (IPSEC/SSL/SRNG) |
| Lead-Free / RoHS | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| Maximum Clock Frequency | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Memory Controller | — | DDR1/DDR2 SDRAM with ECC |
| PCI Interface | — | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| Ethernet | — | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| Operating Temperature Range | — | 0C to +105C (TA) |
| Package | — | 740-TBGA (37.5 x 37.5 mm) |
| RoHS Status | — | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Series | — | PowerQUICC II Pro (MPC8360E family) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Mounting Type | — | Surface Mount (TBGA ball grid) |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |