MPC8358EVVAGDGA vs MPC8360EVVAGDGA 对比
详细并排对比 MPC8358EVVAGDGA 出自 NXP Semiconductors 和 MPC8360EVVAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ 停产NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ 最后一次采购规格对比
| 参数 | MPC8358EVVAGDGA | MPC8360EVVAGDGA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 最后采购期 |
| Architecture | RISC (PowerPC e300) | — |
| 数据总线宽度 | 32-Bit | 32-bit |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | 1 |
| Core Process Technology | 0.13 µm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Package Type | TBGA-740 | — |
| Package Dimensions | 37.5 x 37.5 mm, 1.46 mm height | — |
| Ball Pitch | 1.0 mm | — |
| 引脚数量 | 740 | — |
| 工作温度 | 0 °C to +105 °C | — |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM with ECC | — |
| Ethernet Interfaces | Gigabit (10/100/1000 Mbps) | — |
| USB | USB 2.0 FS device/host | USB 2.0 |
| PCI | PCI 2.2 | — |
| Security Engine | SEC (DES/3DES/AES/SHA) | SEC (IPSEC/SSL/SRNG) |
| Lead-Free / RoHS | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| 最大时钟频率 | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Memory Controller | — | DDR1/DDR2 SDRAM with ECC |
| PCI Interface | — | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| Ethernet | — | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| 工作温度范围 | — | 0C to +105C (TA) |
| 封装 | — | 740-TBGA (37.5 x 37.5 mm) |
| RoHS 状态 | — | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Series | — | PowerQUICC II Pro (MPC8360E family) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| 安装类型 | — | Surface Mount (TBGA ball grid) |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |