MPC8358EVVAGDGA vs MPC8360EVVAGDGA Comparação
Comparação detalhada lado a lado de MPC8358EVVAGDGA por NXP Semiconductors e MPC8360EVVAGDGA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ Fim de vidaNXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Última compraComparação de especificações
| Parâmetro | MPC8358EVVAGDGA | MPC8360EVVAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Fim de vida | Última compra |
| Architecture | RISC (PowerPC e300) | — |
| Largura do barramento de dados | 32-Bit | 32-bit |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | 1 |
| Core Process Technology | 0.13 µm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Package Type | TBGA-740 | — |
| Package Dimensions | 37.5 x 37.5 mm, 1.46 mm height | — |
| Ball Pitch | 1.0 mm | — |
| Contagem de pinos | 740 | — |
| Temperatura de operação | 0 °C to +105 °C | — |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM with ECC | — |
| Ethernet Interfaces | Gigabit (10/100/1000 Mbps) | — |
| USB | USB 2.0 FS device/host | USB 2.0 |
| PCI | PCI 2.2 | — |
| Security Engine | SEC (DES/3DES/AES/SHA) | SEC (IPSEC/SSL/SRNG) |
| Lead-Free / RoHS | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| Frequência máxima de clock | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Memory Controller | — | DDR1/DDR2 SDRAM with ECC |
| PCI Interface | — | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| Ethernet | — | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| Faixa de temperatura de operação | — | 0C to +105C (TA) |
| Encapsulamento | — | 740-TBGA (37.5 x 37.5 mm) |
| Status RoHS | — | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Series | — | PowerQUICC II Pro (MPC8360E family) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Tipo de montagem | — | Surface Mount (TBGA ball grid) |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |