MPC8358EVVAGDGA vs MPC8360EVVAGDGA 비교
다음의 상세 나란히 비교: MPC8358EVVAGDGA 제조: NXP Semiconductors 및 MPC8360EVVAGDGA 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ 단종NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ 최종 구매사양 비교
| 파라미터 | MPC8358EVVAGDGA | MPC8360EVVAGDGA |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 수명 종료 | 최종 구매 |
| Architecture | RISC (PowerPC e300) | — |
| 데이터 버스 폭 | 32-Bit | 32-bit |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | 1 |
| Core Process Technology | 0.13 µm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Package Type | TBGA-740 | — |
| Package Dimensions | 37.5 x 37.5 mm, 1.46 mm height | — |
| Ball Pitch | 1.0 mm | — |
| 핀 수 | 740 | — |
| 동작 온도 | 0 °C to +105 °C | — |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM with ECC | — |
| Ethernet Interfaces | Gigabit (10/100/1000 Mbps) | — |
| USB | USB 2.0 FS device/host | USB 2.0 |
| PCI | PCI 2.2 | — |
| Security Engine | SEC (DES/3DES/AES/SHA) | SEC (IPSEC/SSL/SRNG) |
| Lead-Free / RoHS | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| 최대 클록 주파수 | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Memory Controller | — | DDR1/DDR2 SDRAM with ECC |
| PCI Interface | — | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| Ethernet | — | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| 동작 온도 범위 | — | 0C to +105C (TA) |
| 패키지 | — | 740-TBGA (37.5 x 37.5 mm) |
| RoHS 상태 | — | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Series | — | PowerQUICC II Pro (MPC8360E family) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| 실장 유형 | — | Surface Mount (TBGA ball grid) |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |