MPC8360ECVVAGDGA vs MPC8360VVAGDGA Comparison

Detailed side-by-side comparison of MPC8360ECVVAGDGA by NXP Semiconductors and MPC8360VVAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8360ECVVAGDGA MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA

MPC8360ECVVAGDGA ✓ Active
NXP Semiconductors
MPC8360VVAGDGA MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360VVAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360VVAGDGA ✗ End of Life

Specification Comparison

Parameter MPC8360ECVVAGDGA MPC8360VVAGDGA
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active End of Life
Processor Type PowerPC e300 Microprocessor IC MPC83xx —
Core Architecture Power Architecture (PowerPC), 32-bit PowerPC e300 (Power Architecture technology)
Number of Cores 1 1
Maximum Core Frequency 400 MHz —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Unified Cache 256 KB —
Memory Controller DDR1/DDR2 with ECC —
Ethernet MAC Gigabit Ethernet (10/100/1000) —
PCI Interface Yes (PCI 2.2) 32-bit PCI v2.3
USB Interface USB 2.0 Full-Speed —
Security Engine Integrated SEC (IPsec/SSL acceleration) —
Communication Engine QUICC Engine with TDM/ATM/HDLC —
Operating Voltage (Core) 1.2 V —
Operating Temperature Range -40C to +105C 0C to +105C
Package 740-TBGA (37.5 x 37.5 mm) 740-TBGA (37.5 x 37.5 mm, 1 mm pitch)
Mounting Type Surface Mount (BGA) Surface Mount
Lead-Free Status Lead-Free / RoHS compliant —
Silicon Revision 2.x (denoted by 'E' suffix) —
MSL Level [DATA_NEEDED: MSL level] —
Core Frequency — 400 MHz
Data Bus Width — 32-bit
Series — MPC83xx (PowerQUICC II Pro)
Core Supply Voltage (Vcore) — 1.2 V
I/O Supply Voltage — 1.8 / 2.5 / 3.3 V
Memory Interface — DDR1 / DDR2 memory controller
Ethernet — 1 x 10/100/1000 Mbps MAC (RGMII)
USB — 1 x USB 2.0 (host/device)
Communications Engine — QUICC Engine (HDLC / ATM / TDM)
Serial Interfaces — UART, I2C, SPI, TDM
Lead Free / RoHS — No-Pb (non-ENC, NO-PB variant per Mouser listing)

Datasheets & Resources

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