MPC8360ECVVAGDGA vs MPC8360VVAGDGA 对比
详细并排对比 MPC8360ECVVAGDGA 出自 NXP Semiconductors 和 MPC8360VVAGDGA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8360ECVVAGDGA - 400MHz PowerQUICC II Pro MPU | NXP | 740-TBGA
MPC8360ECVVAGDGA ✓ 量产中规格对比
| 参数 | MPC8360ECVVAGDGA | MPC8360VVAGDGA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 停产 |
| Processor Type | PowerPC e300 Microprocessor IC MPC83xx | — |
| Core Architecture | Power Architecture (PowerPC), 32-bit | PowerPC e300 (Power Architecture technology) |
| Number of Cores | 1 | 1 |
| Maximum Core Frequency | 400 MHz | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Unified Cache | 256 KB | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet MAC | Gigabit Ethernet (10/100/1000) | — |
| PCI Interface | Yes (PCI 2.2) | 32-bit PCI v2.3 |
| USB Interface | USB 2.0 Full-Speed | — |
| Security Engine | Integrated SEC (IPsec/SSL acceleration) | — |
| Communication Engine | QUICC Engine with TDM/ATM/HDLC | — |
| Operating Voltage (Core) | 1.2 V | — |
| 工作温度范围 | -40C to +105C | 0C to +105C |
| 封装 | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Lead-Free Status | Lead-Free / RoHS compliant | — |
| Silicon Revision | 2.x (denoted by 'E' suffix) | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | — |
| Core Frequency | — | 400 MHz |
| 数据总线宽度 | — | 32-bit |
| Series | — | MPC83xx (PowerQUICC II Pro) |
| Core Supply Voltage (Vcore) | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 / 2.5 / 3.3 V |
| Memory Interface | — | DDR1 / DDR2 memory controller |
| Ethernet | — | 1 x 10/100/1000 Mbps MAC (RGMII) |
| USB | — | 1 x USB 2.0 (host/device) |
| Communications Engine | — | QUICC Engine (HDLC / ATM / TDM) |
| Serial Interfaces | — | UART, I2C, SPI, TDM |
| Lead Free / RoHS | — | No-Pb (non-ENC, NO-PB variant per Mouser listing) |