MPC8360EVVAGDGA vs MPC8358EVVAGDGA Comparison
Detailed side-by-side comparison of MPC8360EVVAGDGA by NXP Semiconductors and MPC8358EVVAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Last Time BuyNXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ End of LifeSpecification Comparison
| Parameter | MPC8360EVVAGDGA | MPC8358EVVAGDGA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | End of Life |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | 1 |
| Data Bus Width | 32-bit | 32-Bit |
| Maximum Clock Frequency | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | — |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | — |
| Security Engine | SEC (IPSEC/SSL/SRNG) | SEC (DES/3DES/AES/SHA) |
| USB | USB 2.0 | USB 2.0 FS device/host |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Operating Temperature Range | 0C to +105C (TA) | — |
| Package | 740-TBGA (37.5 x 37.5 mm) | — |
| RoHS Status | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | — |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Mounting Type | Surface Mount (TBGA ball grid) | — |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Architecture | — | RISC (PowerPC e300) |
| Core Frequency | — | 400 MHz |
| Core Process Technology | — | 0.13 µm CMOS |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | TBGA-740 |
| Package Dimensions | — | 37.5 x 37.5 mm, 1.46 mm height |
| Ball Pitch | — | 1.0 mm |
| Pin Count | — | 740 |
| Operating Temperature | — | 0 °C to +105 °C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM with ECC |
| Ethernet Interfaces | — | Gigabit (10/100/1000 Mbps) |
| PCI | — | PCI 2.2 |
| Lead-Free / RoHS | — | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data |