MPC8360EVVAGDGA vs MPC8358EVVAGDGA Vergleich
Detaillierter Direktvergleich von MPC8360EVVAGDGA von NXP Semiconductors und MPC8358EVVAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC8360EVVAGDGA | MPC8358EVVAGDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Ende des Lebenszyklus |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | 1 |
| Datenbusbreite | 32-bit | 32-Bit |
| Maximale Taktfrequenz | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | — |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | — |
| Security Engine | SEC (IPSEC/SSL/SRNG) | SEC (DES/3DES/AES/SHA) |
| USB | USB 2.0 | USB 2.0 FS device/host |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Betriebstemperaturbereich | 0C to +105C (TA) | — |
| Gehäuse | 740-TBGA (37.5 x 37.5 mm) | — |
| RoHS-Status | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | — |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Montageart | Surface Mount (TBGA ball grid) | — |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Architecture | — | RISC (PowerPC e300) |
| Core Frequency | — | 400 MHz |
| Core Process Technology | — | 0.13 µm CMOS |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | TBGA-740 |
| Package Dimensions | — | 37.5 x 37.5 mm, 1.46 mm height |
| Ball Pitch | — | 1.0 mm |
| Pin-Anzahl | — | 740 |
| Betriebstemperatur | — | 0 °C to +105 °C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM with ECC |
| Ethernet Interfaces | — | Gigabit (10/100/1000 Mbps) |
| PCI | — | PCI 2.2 |
| Lead-Free / RoHS | — | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data |