MPC8360EVVAGDGA vs MPC8358EVVAGDGA Comparação
Comparação detalhada lado a lado de MPC8360EVVAGDGA por NXP Semiconductors e MPC8358EVVAGDGA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Última compraNXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ Fim de vidaComparação de especificações
| Parâmetro | MPC8360EVVAGDGA | MPC8358EVVAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Última compra | Fim de vida |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | 1 |
| Largura do barramento de dados | 32-bit | 32-Bit |
| Frequência máxima de clock | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | — |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | — |
| Security Engine | SEC (IPSEC/SSL/SRNG) | SEC (DES/3DES/AES/SHA) |
| USB | USB 2.0 | USB 2.0 FS device/host |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Faixa de temperatura de operação | 0C to +105C (TA) | — |
| Encapsulamento | 740-TBGA (37.5 x 37.5 mm) | — |
| Status RoHS | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | — |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Tipo de montagem | Surface Mount (TBGA ball grid) | — |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Architecture | — | RISC (PowerPC e300) |
| Core Frequency | — | 400 MHz |
| Core Process Technology | — | 0.13 µm CMOS |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | TBGA-740 |
| Package Dimensions | — | 37.5 x 37.5 mm, 1.46 mm height |
| Ball Pitch | — | 1.0 mm |
| Contagem de pinos | — | 740 |
| Temperatura de operação | — | 0 °C to +105 °C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM with ECC |
| Ethernet Interfaces | — | Gigabit (10/100/1000 Mbps) |
| PCI | — | PCI 2.2 |
| Lead-Free / RoHS | — | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data |