MPC8360EVVAGDGA vs MPC8358EVVAGDGA Comparaison
Comparaison détaillée côte à côte de MPC8360EVVAGDGA par NXP Semiconductors et MPC8358EVVAGDGA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Dernier achatNXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC8360EVVAGDGA | MPC8358EVVAGDGA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Fin de vie |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | 1 |
| Largeur du bus de données | 32-bit | 32-Bit |
| Fréquence d'horloge maximale | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | — |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | — |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | — |
| Security Engine | SEC (IPSEC/SSL/SRNG) | SEC (DES/3DES/AES/SHA) |
| USB | USB 2.0 | USB 2.0 FS device/host |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Plage de température de fonctionnement | 0C to +105C (TA) | — |
| Boîtier | 740-TBGA (37.5 x 37.5 mm) | — |
| Statut RoHS | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | — |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | — |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Type de montage | Surface Mount (TBGA ball grid) | — |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Architecture | — | RISC (PowerPC e300) |
| Core Frequency | — | 400 MHz |
| Core Process Technology | — | 0.13 µm CMOS |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.8 V / 2.5 V / 3.3 V |
| Package Type | — | TBGA-740 |
| Package Dimensions | — | 37.5 x 37.5 mm, 1.46 mm height |
| Ball Pitch | — | 1.0 mm |
| Nombre de broches | — | 740 |
| Température de fonctionnement | — | 0 °C to +105 °C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM with ECC |
| Ethernet Interfaces | — | Gigabit (10/100/1000 Mbps) |
| PCI | — | PCI 2.2 |
| Lead-Free / RoHS | — | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data |