MPC8555EPXAQF vs MPC8555EVTAQF Comparison

Detailed side-by-side comparison of MPC8555EPXAQF by NXP Semiconductors and MPC8555EVTAQF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8555EVTAQF MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

MPC8555EVTAQF Obsolete

Specification Comparison

Parameter MPC8555EPXAQF MPC8555EVTAQF
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Obsolete
Architecture PowerPC e500 (Power Architecture technology) —
Core Count 1 1
Data Bus Width 32-Bit 32-bit
Core Frequency (Max) 1.0 GHz —
Supply Voltage (Core) 1.2 V 1.2 V
Package Type FCPBGA (Flip Chip Plastic BGA) FC-PBGA, flip-chip plastic BGA
Pin / Ball Count 783 —
Package Dimensions 29 x 29 mm, 1 mm pitch, 3.75 mm height —
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Series PowerQUICC III (MPC85xx) PowerQUICC III, MPC85xx
Part Marketing Code PQ 37 LITE 8555E —
Integrated Peripherals [DATA_NEEDED: integrated peripherals list] —
Memory Controller [DATA_NEEDED: DDR1/DDR2 support details] —
Ethernet MACs [DATA_NEEDED: number of GbE MACs] —
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
MSL Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Manufacturer — NXP USA Inc.
Core Architecture — PowerPC e500
Core Frequency — 1.0 GHz
Package — 783-FCPBGA (29x29 mm)
Pin Count — 783
Ball Pitch — 1.0 mm
L1 Cache — 32 KB instruction / 32 KB data

Datasheets & Resources

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