MPC8555EPXAQF vs MPC8555EVTAQF 对比

详细并排对比 MPC8555EPXAQF 出自 NXP Semiconductors 和 MPC8555EVTAQF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8555EVTAQF MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA

MPC8555EVTAQF Obsolete

规格对比

参数 MPC8555EPXAQF MPC8555EVTAQF
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 Obsolete
Architecture PowerPC e500 (Power Architecture technology) —
Core Count 1 1
数据总线宽度 32-Bit 32-bit
Core Frequency (Max) 1.0 GHz —
Supply Voltage (Core) 1.2 V 1.2 V
Package Type FCPBGA (Flip Chip Plastic BGA) FC-PBGA, flip-chip plastic BGA
Pin / Ball Count 783 —
Package Dimensions 29 x 29 mm, 1 mm pitch, 3.75 mm height —
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Series PowerQUICC III (MPC85xx) PowerQUICC III, MPC85xx
Part Marketing Code PQ 37 LITE 8555E —
Integrated Peripherals [DATA_NEEDED: integrated peripherals list] —
Memory Controller [DATA_NEEDED: DDR1/DDR2 support details] —
Ethernet MACs [DATA_NEEDED: number of GbE MACs] —
RoHS 状态 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
MSL 等级 [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Manufacturer — NXP USA Inc.
Core Architecture — PowerPC e500
Core Frequency — 1.0 GHz
封装 — 783-FCPBGA (29x29 mm)
引脚数量 — 783
Ball Pitch — 1.0 mm
L1 Cache — 32 KB instruction / 32 KB data

数据手册与资源

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