MPC8555EVTAQF vs MPC8555EPXAQF Comparison
Detailed side-by-side comparison of MPC8555EVTAQF by NXP Semiconductors and MPC8555EPXAQF by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA
MPC8555EVTAQF ObsoleteNXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF NrndSpecification Comparison
| Parameter | MPC8555EVTAQF | MPC8555EPXAQF |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | NRND |
| Manufacturer | NXP USA Inc. | — |
| Series | PowerQUICC III, MPC85xx | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 | — |
| Core Count | 1 | 1 |
| Data Bus Width | 32-bit | 32-Bit |
| Core Frequency | 1.0 GHz | — |
| Package | 783-FCPBGA (29x29 mm) | — |
| Package Type | FC-PBGA, flip-chip plastic BGA | FCPBGA (Flip Chip Plastic BGA) |
| Pin Count | 783 | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage (Core) | 1.2 V | 1.2 V |
| Mounting Type | Surface Mount | Surface Mount |
| L1 Cache | 32 KB instruction / 32 KB data | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| MSL Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Architecture | — | PowerPC e500 (Power Architecture technology) |
| Core Frequency (Max) | — | 1.0 GHz |
| Pin / Ball Count | — | 783 |
| Package Dimensions | — | 29 x 29 mm, 1 mm pitch, 3.75 mm height |
| Part Marketing Code | — | PQ 37 LITE 8555E |
| Integrated Peripherals | — | [DATA_NEEDED: integrated peripherals list] |
| Memory Controller | — | [DATA_NEEDED: DDR1/DDR2 support details] |
| Ethernet MACs | — | [DATA_NEEDED: number of GbE MACs] |