MPC8555EVTAQF vs MPC8555EPXAQF 对比
详细并排对比 MPC8555EVTAQF 出自 NXP Semiconductors 和 MPC8555EPXAQF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA
MPC8555EVTAQF ObsoleteNXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF Nrnd规格对比
| 参数 | MPC8555EVTAQF | MPC8555EPXAQF |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| Manufacturer | NXP USA Inc. | — |
| Series | PowerQUICC III, MPC85xx | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 | — |
| Core Count | 1 | 1 |
| 数据总线宽度 | 32-bit | 32-Bit |
| Core Frequency | 1.0 GHz | — |
| 封装 | 783-FCPBGA (29x29 mm) | — |
| Package Type | FC-PBGA, flip-chip plastic BGA | FCPBGA (Flip Chip Plastic BGA) |
| 引脚数量 | 783 | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage (Core) | 1.2 V | 1.2 V |
| 安装类型 | Surface Mount | Surface Mount |
| L1 Cache | 32 KB instruction / 32 KB data | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| MSL 等级 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Architecture | — | PowerPC e500 (Power Architecture technology) |
| Core Frequency (Max) | — | 1.0 GHz |
| Pin / Ball Count | — | 783 |
| Package Dimensions | — | 29 x 29 mm, 1 mm pitch, 3.75 mm height |
| Part Marketing Code | — | PQ 37 LITE 8555E |
| Integrated Peripherals | — | [DATA_NEEDED: integrated peripherals list] |
| Memory Controller | — | [DATA_NEEDED: DDR1/DDR2 support details] |
| Ethernet MACs | — | [DATA_NEEDED: number of GbE MACs] |