MPC8555EVTAQF vs MPC8555EPXAQF Сравнение
Подробное сравнение бок о бок MPC8555EVTAQF от NXP Semiconductors и MPC8555EPXAQF от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA
MPC8555EVTAQF ObsoleteNXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF NrndСравнение характеристик
| Параметр | MPC8555EVTAQF | MPC8555EPXAQF |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Obsolete | NRND |
| Manufacturer | NXP USA Inc. | — |
| Series | PowerQUICC III, MPC85xx | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 | — |
| Core Count | 1 | 1 |
| Разрядность шины данных | 32-bit | 32-Bit |
| Core Frequency | 1.0 GHz | — |
| Корпус | 783-FCPBGA (29x29 mm) | — |
| Package Type | FC-PBGA, flip-chip plastic BGA | FCPBGA (Flip Chip Plastic BGA) |
| Число выводов | 783 | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage (Core) | 1.2 V | 1.2 V |
| Тип монтажа | Surface Mount | Surface Mount |
| L1 Cache | 32 KB instruction / 32 KB data | — |
| Рабочая температура | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Статус RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| Уровень MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Architecture | — | PowerPC e500 (Power Architecture technology) |
| Core Frequency (Max) | — | 1.0 GHz |
| Pin / Ball Count | — | 783 |
| Package Dimensions | — | 29 x 29 mm, 1 mm pitch, 3.75 mm height |
| Part Marketing Code | — | PQ 37 LITE 8555E |
| Integrated Peripherals | — | [DATA_NEEDED: integrated peripherals list] |
| Memory Controller | — | [DATA_NEEDED: DDR1/DDR2 support details] |
| Ethernet MACs | — | [DATA_NEEDED: number of GbE MACs] |