MPC8555EVTAQF vs MPC8555EPXAQF 비교
다음의 상세 나란히 비교: MPC8555EVTAQF 제조: NXP Semiconductors 및 MPC8555EPXAQF 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA
MPC8555EVTAQF ObsoleteNXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF Nrnd사양 비교
| 파라미터 | MPC8555EVTAQF | MPC8555EPXAQF |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | Obsolete | NRND |
| Manufacturer | NXP USA Inc. | — |
| Series | PowerQUICC III, MPC85xx | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 | — |
| Core Count | 1 | 1 |
| 데이터 버스 폭 | 32-bit | 32-Bit |
| Core Frequency | 1.0 GHz | — |
| 패키지 | 783-FCPBGA (29x29 mm) | — |
| Package Type | FC-PBGA, flip-chip plastic BGA | FCPBGA (Flip Chip Plastic BGA) |
| 핀 수 | 783 | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage (Core) | 1.2 V | 1.2 V |
| 실장 유형 | Surface Mount | Surface Mount |
| L1 Cache | 32 KB instruction / 32 KB data | — |
| 동작 온도 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| MSL 레벨 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Architecture | — | PowerPC e500 (Power Architecture technology) |
| Core Frequency (Max) | — | 1.0 GHz |
| Pin / Ball Count | — | 783 |
| Package Dimensions | — | 29 x 29 mm, 1 mm pitch, 3.75 mm height |
| Part Marketing Code | — | PQ 37 LITE 8555E |
| Integrated Peripherals | — | [DATA_NEEDED: integrated peripherals list] |
| Memory Controller | — | [DATA_NEEDED: DDR1/DDR2 support details] |
| Ethernet MACs | — | [DATA_NEEDED: number of GbE MACs] |