MPC8555EVTAQF vs MPC8555EPXAQF Perbandingan
Perbandingan bersamaan detil MPC8555EVTAQF dari NXP Semiconductors dan MPC8555EPXAQF dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA
MPC8555EVTAQF ObsoleteNXP Semiconductors
MPC8555EPXAQF - PowerQUICC III 1GHz e500 MPU | NXP | Networking
MPC8555EPXAQF NrndPerbandingan Spesifikasi
| Parameter Umum | MPC8555EVTAQF | MPC8555EPXAQF |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Obsolete | NRND |
| Manufacturer | NXP USA Inc. | — |
| Series | PowerQUICC III, MPC85xx | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 | — |
| Core Count | 1 | 1 |
| Lebar Bus Data | 32-bit | 32-Bit |
| Core Frequency | 1.0 GHz | — |
| Paket | 783-FCPBGA (29x29 mm) | — |
| Package Type | FC-PBGA, flip-chip plastic BGA | FCPBGA (Flip Chip Plastic BGA) |
| Jumlah Pin | 783 | — |
| Ball Pitch | 1.0 mm | — |
| Supply Voltage (Core) | 1.2 V | 1.2 V |
| Tipe Mounting | Surface Mount | Surface Mount |
| L1 Cache | 32 KB instruction / 32 KB data | — |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS compliance status] |
| Level MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Architecture | — | PowerPC e500 (Power Architecture technology) |
| Core Frequency (Max) | — | 1.0 GHz |
| Pin / Ball Count | — | 783 |
| Package Dimensions | — | 29 x 29 mm, 1 mm pitch, 3.75 mm height |
| Part Marketing Code | — | PQ 37 LITE 8555E |
| Integrated Peripherals | — | [DATA_NEEDED: integrated peripherals list] |
| Memory Controller | — | [DATA_NEEDED: DDR1/DDR2 support details] |
| Ethernet MACs | — | [DATA_NEEDED: number of GbE MACs] |