MPC855TVR50D4 vs MPC855TCZQ50D4 Comparison
Detailed side-by-side comparison of MPC855TVR50D4 by NXP Semiconductors and MPC855TCZQ50D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
MPC855TCZQ50D4 ✗ End of LifeSpecification Comparison
| Parameter | MPC855TVR50D4 | MPC855TCZQ50D4 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $48.10 | $22.10 |
| Core Architecture | Power Architecture (PowerPC) 32-bit, 1 core | 32-bit PowerPC with integrated CPM (Communications Processor Module) |
| Core Frequency | 50 MHz | — |
| Series | PowerQUICC I (MPC8xx) | — |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI |
| Cache Size | 8 KB unified instruction/data | — |
| Supply Voltage | 2.0 V to 3.6 V | 3.3 V |
| Operating Temperature | 0 C to +95 C (commercial) | -40C to +95C |
| Package | 357-Ball PBGA (25x25 mm) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Ethernet | 10/100 Mbps (FCC/FEC) | — |
| Memory Controller | SDRAM, ROM, Flash, PCMCIA | — |
| Core Marking Family | MPC85xx | — |
| MSL Level | 3 | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (legacy BGA contains lead) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Product Type | — | Microprocessor (MPU) |
| Processor Family | — | PowerQUICC MPC8xx / PowerPC |
| Core Clock Speed | — | 50 MHz |
| Number of Cores | — | 1 |
| Data Bus Width | — | 32-bit |
| Package / Case | — | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm |
| On-chip Memory Controller | — | Yes (SDRAM, DRAM, SRAM, Flash support) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Process Technology | — | 0.32 um CMOS |