MPC855TVR50D4 vs MPC855TCZQ50D4 Comparação
Comparação detalhada lado a lado de MPC855TVR50D4 por NXP Semiconductors e MPC855TCZQ50D4 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
MPC855TCZQ50D4 ✗ Fim de vidaComparação de especificações
| Parâmetro | MPC855TVR50D4 | MPC855TCZQ50D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $48,10 | $22,10 |
| Core Architecture | Power Architecture (PowerPC) 32-bit, 1 core | 32-bit PowerPC with integrated CPM (Communications Processor Module) |
| Core Frequency | 50 MHz | — |
| Series | PowerQUICC I (MPC8xx) | — |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI |
| Cache Size | 8 KB unified instruction/data | — |
| Tensão de alimentação | 2.0 V to 3.6 V | 3.3 V |
| Temperatura de operação | 0 C to +95 C (commercial) | -40C to +95C |
| Encapsulamento | 357-Ball PBGA (25x25 mm) | — |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Ethernet | 10/100 Mbps (FCC/FEC) | — |
| Memory Controller | SDRAM, ROM, Flash, PCMCIA | — |
| Core Marking Family | MPC85xx | — |
| Nível MSL | 3 | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (legacy BGA contains lead) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Product Type | — | Microprocessor (MPU) |
| Processor Family | — | PowerQUICC MPC8xx / PowerPC |
| Core Clock Speed | — | 50 MHz |
| Number of Cores | — | 1 |
| Largura do barramento de dados | — | 32-bit |
| Encapsulamento / Caixa | — | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm |
| On-chip Memory Controller | — | Yes (SDRAM, DRAM, SRAM, Flash support) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Process Technology | — | 0.32 um CMOS |