MPC855TVR50D4 vs MPC855TCZQ50D4 Comparaison
Comparaison détaillée côte à côte de MPC855TVR50D4 par NXP Semiconductors et MPC855TCZQ50D4 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MPC855TVR50D4 | MPC855TCZQ50D4 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $48,10 | $22,10 |
| Core Architecture | Power Architecture (PowerPC) 32-bit, 1 core | 32-bit PowerPC with integrated CPM (Communications Processor Module) |
| Core Frequency | 50 MHz | — |
| Series | PowerQUICC I (MPC8xx) | — |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI |
| Cache Size | 8 KB unified instruction/data | — |
| Tension d'alimentation | 2.0 V to 3.6 V | 3.3 V |
| Température de fonctionnement | 0 C to +95 C (commercial) | -40C to +95C |
| Boîtier | 357-Ball PBGA (25x25 mm) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Ethernet | 10/100 Mbps (FCC/FEC) | — |
| Memory Controller | SDRAM, ROM, Flash, PCMCIA | — |
| Core Marking Family | MPC85xx | — |
| Niveau MSL | 3 | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (legacy BGA contains lead) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Product Type | — | Microprocessor (MPU) |
| Processor Family | — | PowerQUICC MPC8xx / PowerPC |
| Core Clock Speed | — | 50 MHz |
| Number of Cores | — | 1 |
| Largeur du bus de données | — | 32-bit |
| Boîtier / Format | — | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm |
| On-chip Memory Controller | — | Yes (SDRAM, DRAM, SRAM, Flash support) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Process Technology | — | 0.32 um CMOS |