MPC855TVR50D4 vs MPC855TCZQ50D4 Comparación
Comparación detallada lado a lado de MPC855TVR50D4 por NXP Semiconductors y MPC855TCZQ50D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
MPC855TCZQ50D4 ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC855TVR50D4 | MPC855TCZQ50D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $48,10 | $22,10 |
| Core Architecture | Power Architecture (PowerPC) 32-bit, 1 core | 32-bit PowerPC with integrated CPM (Communications Processor Module) |
| Core Frequency | 50 MHz | — |
| Series | PowerQUICC I (MPC8xx) | — |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI |
| Cache Size | 8 KB unified instruction/data | — |
| Tensión de alimentación | 2.0 V to 3.6 V | 3.3 V |
| Temperatura de funcionamiento | 0 C to +95 C (commercial) | -40C to +95C |
| Encapsulado | 357-Ball PBGA (25x25 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Ethernet | 10/100 Mbps (FCC/FEC) | — |
| Memory Controller | SDRAM, ROM, Flash, PCMCIA | — |
| Core Marking Family | MPC85xx | — |
| Nivel MSL | 3 | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (legacy BGA contains lead) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Product Type | — | Microprocessor (MPU) |
| Processor Family | — | PowerQUICC MPC8xx / PowerPC |
| Core Clock Speed | — | 50 MHz |
| Number of Cores | — | 1 |
| Ancho del bus de datos | — | 32-bit |
| Encapsulado / Carcasa | — | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm |
| On-chip Memory Controller | — | Yes (SDRAM, DRAM, SRAM, Flash support) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Process Technology | — | 0.32 um CMOS |