MPC855TVR50D4 vs MPC855TCZQ50D4 Vergleich
Detaillierter Direktvergleich von MPC855TVR50D4 von NXP Semiconductors und MPC855TCZQ50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
MPC855TCZQ50D4 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC855TVR50D4 | MPC855TCZQ50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $48,10 | $22,10 |
| Core Architecture | Power Architecture (PowerPC) 32-bit, 1 core | 32-bit PowerPC with integrated CPM (Communications Processor Module) |
| Core Frequency | 50 MHz | — |
| Series | PowerQUICC I (MPC8xx) | — |
| Integrated Peripherals | CPM, ENET, ATM, HDLC, PCMCIA | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI |
| Cache Size | 8 KB unified instruction/data | — |
| Versorgungsspannung | 2.0 V to 3.6 V | 3.3 V |
| Betriebstemperatur | 0 C to +95 C (commercial) | -40C to +95C |
| Gehäuse | 357-Ball PBGA (25x25 mm) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Ethernet | 10/100 Mbps (FCC/FEC) | — |
| Memory Controller | SDRAM, ROM, Flash, PCMCIA | — |
| Core Marking Family | MPC85xx | — |
| MSL-Level | 3 | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Non-Compliant (legacy BGA contains lead) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale / Motorola) |
| Product Type | — | Microprocessor (MPU) |
| Processor Family | — | PowerQUICC MPC8xx / PowerPC |
| Core Clock Speed | — | 50 MHz |
| Number of Cores | — | 1 |
| Datenbusbreite | — | 32-bit |
| Gehäuse / Bauform | — | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm |
| On-chip Memory Controller | — | Yes (SDRAM, DRAM, SRAM, Flash support) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |
| Process Technology | — | 0.32 um CMOS |