MPC860SRVR66D4 vs MPC860ENVR66D4 Comparison

Detailed side-by-side comparison of MPC860SRVR66D4 by NXP Semiconductors and MPC860ENVR66D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC860SRVR66D4 MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860SRVR66D4 ⚠ Last Time Buy
NXP Semiconductors
MPC860ENVR66D4 MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP

MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP

MPC860ENVR66D4 ⚠ Last Time Buy

Specification Comparison

Parameter MPC860SRVR66D4 MPC860ENVR66D4
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $89.75 $48.85
Processor Type MPC8xx PowerQUICC MPC8xx PowerQUICC, 32-Bit
Core Architecture PowerPC 32-bit PowerPC Embedded
Number of Cores 1 1
Clock Speed 66 MHz —
Operating Voltage 3.3 V (5 V tolerant I/O) —
Instruction Cache 4 Kbyte 4 KB
Data Cache 4 Kbyte 4 KB
MMU Yes Yes (integrated)
Communication Processor Module (CPM) Yes (FCC/SCC/SMC/SPI/I2C) —
Multiply-Accumulate (MAC) Unit Yes —
JTAG / Debug IEEE 1149.1 compliant —
Operating Temperature -40C to +95C [DATA_NEEDED: operating temperature range]
Package / Case 357-PBGA (25 mm x 25 mm) 357-PBGA (25x25 mm)
Mounting Type Surface Mount (BGA) Surface Mount
Packaging (Shipping) Tray —
Lead Free Status Lead Free —
RoHS Status RoHS Compliant Compliant
Core Clock Speed — 66 MHz
Operating Supply Voltage — 3.3 V
Communications Processor Module (CPM) — Yes (SCC/SMC/SPI/I2C)
Ethernet MAC — Dual 10/100 Mbps (Fast Ethernet)
Lead Free — Yes
Packaging — Tray
Process Technology — 0.32 um CMOS

Datasheets & Resources

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