MPC860SRVR66D4 vs MPC860ENVR66D4 对比

详细并排对比 MPC860SRVR66D4 出自 NXP Semiconductors 和 MPC860ENVR66D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC860SRVR66D4 MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860SRVR66D4 ⚠ 最后一次采购
NXP Semiconductors
MPC860ENVR66D4 MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP

MPC860ENVR66D4 - 66MHz PowerQUICC MPU, 357-BBGA | NXP

MPC860ENVR66D4 ⚠ 最后一次采购

规格对比

参数 MPC860SRVR66D4 MPC860ENVR66D4
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 最后采购期
库存状态 有库存 有库存
单价(USD) $89.75 $48.85
Processor Type MPC8xx PowerQUICC MPC8xx PowerQUICC, 32-Bit
Core Architecture PowerPC 32-bit PowerPC Embedded
Number of Cores 1 1
Clock Speed 66 MHz —
Operating Voltage 3.3 V (5 V tolerant I/O) —
Instruction Cache 4 Kbyte 4 KB
Data Cache 4 Kbyte 4 KB
MMU Yes Yes (integrated)
Communication Processor Module (CPM) Yes (FCC/SCC/SMC/SPI/I2C) —
Multiply-Accumulate (MAC) Unit Yes —
JTAG / Debug IEEE 1149.1 compliant —
工作温度 -40C to +95C [DATA_NEEDED: operating temperature range]
封装 / 外壳 357-PBGA (25 mm x 25 mm) 357-PBGA (25x25 mm)
安装类型 Surface Mount (BGA) Surface Mount
Packaging (Shipping) Tray —
Lead Free Status Lead Free —
RoHS 状态 RoHS Compliant Compliant
Core Clock Speed — 66 MHz
工作电源电压 — 3.3 V
Communications Processor Module (CPM) — Yes (SCC/SMC/SPI/I2C)
Ethernet MAC — Dual 10/100 Mbps (Fast Ethernet)
Lead Free — Yes
Packaging — Tray
Process Technology — 0.32 um CMOS

数据手册与资源

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