MPC870VR66 vs MPC875VR80 Comparison
Detailed side-by-side comparison of MPC870VR66 by NXP Semiconductors and MPC875VR80 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MPC870VR66 | MPC875VR80 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC, MPC8xx | — |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 core |
| Data Bus Width | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | — |
| Operating Supply Voltage | 3.3 V | — |
| Operating Temperature Range | 0C to +95C | — |
| Package / Case | 256-BGA (PBGA), 23x23 mm | — |
| Mounting Type | Surface Mount | Surface-mount BGA |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS Status | RoHS Compliant | unknown |
| Processor Type | MPC8xx PowerQUICC Communications Processor | MPC8xx communications microprocessor |
| Core Architecture | — | 32-bit Power Architecture |
| Maximum Clock Frequency | — | 80 MHz |
| Supply Voltage | — | 3.3 V |
| Process Technology | — | 0.18 µm |
| Package Type | — | 256-ball PBGA (23 x 23 mm) |
| Device Category | — | Microprocessor (MPU) |
| Operating Temperature | — | 0°C to 95°C |
| Memory Management | — | Memory-management units included |
| Instruction Cache | — | [DATA_NEEDED: instruction cache size] |
| Data Cache | — | [DATA_NEEDED: data cache size] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface configuration] |
| Maximum Operating Current | — | [DATA_NEEDED: maximum operating current] |
| Maximum Supply Voltage | — | [DATA_NEEDED: maximum supply voltage] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |