MPC870VR66 vs MPC875VR80 Perbandingan
Perbandingan bersamaan detil MPC870VR66 dari NXP Semiconductors dan MPC875VR80 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC870VR66 | MPC875VR80 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC, MPC8xx | — |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 core |
| Lebar Bus Data | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | — |
| Tegangan Pemuat Kerja | 3.3 V | — |
| Rentang Suhu Kerja | 0C to +95C | — |
| Paket / Case | 256-BGA (PBGA), 23x23 mm | — |
| Tipe Mounting | Surface Mount | Surface-mount BGA |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Status RoHS | RoHS Compliant | unknown |
| Processor Type | MPC8xx PowerQUICC Communications Processor | MPC8xx communications microprocessor |
| Core Architecture | — | 32-bit Power Architecture |
| Frekuensi Bawah Maximum | — | 80 MHz |
| Tegangan Pemuat | — | 3.3 V |
| Process Technology | — | 0.18 µm |
| Package Type | — | 256-ball PBGA (23 x 23 mm) |
| Device Category | — | Microprocessor (MPU) |
| Suhu Kerja | — | 0°C to 95°C |
| Memory Management | — | Memory-management units included |
| Instruction Cache | — | [DATA_NEEDED: instruction cache size] |
| Data Cache | — | [DATA_NEEDED: data cache size] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface configuration] |
| Maximum Operating Current | — | [DATA_NEEDED: maximum operating current] |
| Maximum Supply Voltage | — | [DATA_NEEDED: maximum supply voltage] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |